We put a lot of effort to maintain fine grain size with great uniformity on our targets. We also develop customized targets
Stable phase to ensure the stability of the coating process
Capable to manufacturing OFC Backing plate and provide overhaul services
Customizable hardness and functionality
Both inward and outward folding
Mainly used in miniaturized semiconductor process
Fast and low temperature deposition of uniform thin films
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© 2022 D & P Technology, Co., LTD.
D & P Technology, Co., LTD.
13F.-10, No. 423, Zhengguang Rd. Taoyuan Dist., Taoyuan City 330060 , Taiwan